Advanced packaging is Malaysia’s next test in AI semiconductor value chain - AMRO - TNGlobal

- The ASEAN+3 Macroeconomic Research Office reported on Tuesday that Malaysia is expanding its role in advanced semiconductor packaging to capture more value from the artificial intelligence boom.
- The organization stated that the country must now ensure foreign investment leads to higher domestic productivity, technology ownership, and skilled employment.
- This shift determines whether Malaysia can move up the semiconductor value chain to secure higher-paying jobs and more intellectual property.
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