Global Market Watch: Advanced Packaging Takes the Stage
• TSMC and Intel are advancing CoPoS (Chip-on-Panel-on-Substrate) glass substrate packaging to improve semiconductor efficiency. • Intel reports that its EMIB-T packaging yield has exceeded 90%, aiming for mass production by 2027 at approximately half the cost of TSMC’s CoWoS. • This shift occurs as embodied AI moves into a scaling phase, making commercial deployment critical for companies seeking funding.
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