Image: DIGITIMESWeekly news roundup: AI memory race heats up, Taiwan manufacturing rebounds, Nexperia rift deepens
• Micron is preparing to roughly double its high-bandwidth memory (HBM) capacity by the end of 2026. • The company plans to reach a production volume of approximately 100,000 wafers per month by installing new tools in Taiwan, Singapore, and Hiroshima. • This expansion aims to narrow the scale gap between Micron and its primary competitors, Samsung Electronics and SK Hynix.
digitimes.com











