Image: DIGITIMESWeekly news roundup: AI memory race heats up, Taiwan manufacturing rebounds, Nexperia rift deepens
β’ Micron is preparing to roughly double its high-bandwidth memory (HBM) capacity by the end of 2026. β’ The company plans to reach a production volume of approximately 100,000 wafers per month by installing new tools in Taiwan, Singapore, and Hiroshima. β’ This expansion aims to narrow the scale gap between Micron and its primary competitors, Samsung Electronics and SK Hynix.
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