छवि: DIGITIMESWeekly news roundup: <strong>AI boom strains chips; </strong>Google's TPUs pay off, China eyes 3nm without EUV
• Semiconductor and AI supply chains faced intensifying competition and bottlenecks this week, including equipment shortages and packaging debates. • Chinese researchers outlined a path to produce sub-3nm GAA chips using DUV lithography, which avoids the need for EUV machines. • These supply chain constraints and packaging disputes could slow the expansion of chip production capacity for the AI market.
digitimes.com



